EM/R20 Double Trench Chip Data Sheet

Features

  • SIPOS & Glass Passivation Junction & LTO
  • Crystal Method: CZ / FZ
  • Double Trench
  • Low Forward Voltage Drop
  • High Current Capability
  • High Reliability
  •  High Surge Current Capability
  • Compatible With Soldering
  • Surface Metalization:Ni or Ni/Au
  • Ni TypicalThickness:0.4um
  • Au TypicalThickness:0.01um

Chip size

+1/-2 )( mil

B +1/-2 )( mil

C ±10   (um)

180*180mil

180

128

340

200*200mil

200

148

340

215*215mil

215

163

340

260*260mil

260

210

340

280*280mil

280

230

340

300*300mil

300

250

340

320*320mil

320

270

340

350*350mil

350

300

340

395*395mil

395

335

340

420*420mil

420

360

340

480*480mil

480

420

340

500*500mil

500

440

340

 

 

Electrical Characteristics (TA=25)

Parameter

Symbol

VALUE

UNIT

Maximum repetitive peak reverse voltage

VRRM

1600~2000

V

Maximum RMS voltage

VRMS

1280~1600

V

Maximum DC blocking voltage

VDC

1600~2000

V

Maximum average forward rectified current

IF(AV)

See Next Table

A

Maximum instantaneous forwad voltage at IF

VF

See Next Table

V

Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load

IFSM

See Next Table

A

Maximum DC reverse current at rated DC blocking voltage

IR

See Next Table

uA

Maximum reverse recovery time.Test conditions:IF=0.5A, IR=1A, IRR=0.25A.

Trr

See Next Table

ns

Operating tempeterature range

Tj

 -55150