EM/R20 Double Trench Chip Data Sheet

Features
- SIPOS & Glass Passivation Junction & LTO
- Crystal Method: CZ / FZ
- Double Trench
- Low Forward Voltage Drop
- High Current Capability
- High Reliability
- High Surge Current Capability
- Compatible With Soldering
- Surface Metalization:Ni or Ni/Au
- Ni TypicalThickness:0.4um
- Au TypicalThickness:0.01um
Chip size
|
A
(
+1/-2
)(
mil
)
|
B
(
+1/-2
)(
mil
)
|
C
(
±10
)
(um)
|
180*180mil
|
180
|
128
|
340
|
200*200mil
|
200
|
148
|
340
|
215*215mil
|
215
|
163
|
340
|
260*260mil |
260
|
210
|
340
|
280*280mil
|
280
|
230
|
340
|
300*300mil
|
300
|
250
|
340
|
320*320mil
|
320
|
270
|
340
|
350*350mil
|
350
|
300
|
340
|
395*395mil
|
395
|
335
|
340
|
420*420mil
|
420
|
360
|
340
|
480*480mil
|
480
|
420
|
340
|
500*500mil
|
500
|
440
|
340
|
Electrical Characteristics (TA=25℃)
Parameter |
Symbol |
VALUE |
UNIT |
Maximum repetitive peak reverse voltage |
VRRM |
1600~2000 |
V |
Maximum RMS voltage |
VRMS |
1280~1600 |
V |
Maximum DC blocking voltage |
VDC |
1600~2000 |
V |
Maximum average forward rectified current |
IF(AV) |
See Next Table |
A |
Maximum instantaneous forwad voltage at IF |
VF |
See Next Table |
V |
Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load |
IFSM |
See Next Table |
A |
Maximum DC reverse current at rated DC blocking voltage |
IR |
See Next Table |
uA |
Maximum reverse recovery time.Test conditions:IF=0.5A, IR=1A, IRR=0.25A. |
Trr |
See Next Table |
ns |
Operating tempeterature range |
Tj |
-55~150 |
℃ |