Core Technology
Complete product range, with a total of more than a thousand different diode products in five major categories, which can provide customers with one-stop services. In particular, the SF category (especially the MUR category), automotive AV category, SDS-BJT substrate diffusion wafers, and TVS chips, which have a good reputation in both domestic and international markets.
The company's products all have independent intellectual property rights, and the products have strong technological innovation capabilities.
Our products are manufactured with mature production processes, enabling rapid market responsiveness and short lead times.
The product parameters have good consistency and high reliability. Some process capabilities have reached the level of international first-tier semiconductor companies.
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As China's most comprehensive supplier of diffusion wafers, our product performance can cover more than 99% of the categories of diffusion chips in the domestic market, and some products have been applied as a substitute for epitaxial planar wafers.
With the advantages of IDM and a strong R&D team, company adjust to the changes in terminal applications, to customize personalized products and solve practical problems for different customers.
It is one of the larger production bases of intelligent digital rectifier diode chips in China. The products have a high reputation in the industry, with high customer satisfaction and loyalty.
Company is currently a qualified supplier for major semiconductor packaging enterprises at home and abroad in the fields of rectification, TVS, deep junction diffusion wafers, etc.
The first domestic company to launch a 4-inch AUTO and AV automotive rectifier chip using a GPP chip form, has passed certification from world-renowned auto parts companies such as Valeo.
Domestically first-ever BJT triple diffusion process used for high-current fast charging ultra-fast recovery chip
Domestically first deep diffusion substrate manufacturing SF, HER type rectifier diode diffusion slice and chip
Patent situation
invention patent
utility model patent
National Qualification
Core technology coverage
|
Type |
Name |
|---|---|
|
Invention Patent |
A P+N+type low-voltage silicon diffusion sheet, silicon diode and its preparation method for removing the intrinsic region |
|
Invention Patent |
A N+PN-PN+type forward and reverse overvoltage protection silicon diode and its silicon core and manufacturing method |
|
Invention Patent |
U-shaped etched right angle table silicon diode and its silicon core and preparation method |
|
Invention Patent |
Preparation method of groove etching conical positive surface silicon core and silicon diode |
|
Invention Patent |
P+N+type low-voltage silicon diffusion plate and its silicon diode for heterogeneous impurity diffusion docking |
|
Invention Patent |
A manufacturing method for P-type impurity diffusion junction shielded gate silicon diode |
|
Invention Patent |
A GPP diode chip production process using honeycomb lithography and knife scraping method |
|
Invention Patent |
Method and device for low-temperature oxidation masking PN junction orientation to form palladium composite centers |
|
Type |
Name |
|---|---|
|
Utility Model |
A U-shaped etched right angle table silicon diode and its silicon core and silicon diffusion wafer |
|
Utility Model |
A N+PN-PN+type forward and reverse overvoltage protection silicon diode and its silicon core |
|
Utility Model |
A conical groove surface silicon diode and its chip |
|
Utility Model |
A P-type impurity diffusion junction shielding gate silicon diode silicon core and its diode |
|
Utility Model |
A hexagonal honeycomb double groove lithography plate |
|
Utility Model |
A device for preventing bending of surface mount components with bent feet |
|
Utility Model |
A multi pin direct insertion diode |
|
Type |
Name |
|---|---|
|
software copyright |
Chip diode chip production batch number ACCESS management system V1.0 |
|
software copyright |
Bipolar diffusion polishing pad diffusion concentration SPC control system V1.0 |
|
software copyright |
MES Manufacturing Management System V1.0 for Chip Diode Diffusion Chip Production |
|
software copyright |
Bipolar diffusion polishing pad ANT07; BJT13007 Product PPAP Certification System V1.0 |
Message
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Contact Us
Telephone:0571-86698096
Address: Liming Community, Heshun Village, Jingjiang Street, Xiaoshan District, Hangzhou City, Zhejiang Province
E-mail:sales@hzhangxin.com
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